Application Products with High-density/High-frequency electronics packaging technologies, High-density Substrates/Interporzers, IC Packages, Electronic Components, Embedded Packaging Board, System-in-a-Package, Display Device/Optical Device, Materials related to Electronics Packaging, Lead-free Solder, Polymer for High-frequency, Bonding/Mounting/Dispenser/Paste Printing Machines, Equipment for manufacturing, Environmental Consideration technologies, Recycle System, Electronics Packaging (Jisso) related Publication, Information, Services, etc.

The Microelectronics Show exhibition space will proved two areas such as "Dispensers/Mounting/Bonding Area" for exhibition of high-density electronics packaging process and "Soldering Area" for lead-free soldering process exhibition in this time.