X-ray Inspection Equipment, Infrared Test Equipment, Board Vision Inspection Equipment, Solder Vision Inspection Equipment, Ball Machine Vision Inspection Equipment, TAB Vision Inspection Equipment, Bump Vision Inspection Equipment, Lead Frame Vision Inspection Equipment, PCB Vision Inspection Equipment, Electronic Components Vision Inspection Equipment, In-Circuit Testers, Functional Solder Testers, Bare Board Testers, IC / LSI Testers, Testing Sockets for BGA/CSP, Burn-in Inspection Equipment, Inspection Jig / Test Fixtures / Probes / Testing Stages, Thermostatic and Humid Static Testing Units, Environmental Test Equipment, 2-D / 3-D Inspection Systems, Film Thickness Measurement Equipment, Optical Microscopes, Endurance Testing Equipment / Vibration Gauge, Viscometers.

Inspection, test equipment and systems for electronic packaging and production and other related products. Concurrent shows : INTERNEPCON JAPAN / IC PACKAGING TECHNOLOGY JAPAN / PRINTED WIRING BOARDS EXPO / INTERNATIONAL ELECTRONIC COMPONENTS TRADE SHOW / PHOTONICS JAPAN / MATERIAL JAPAN / INT'L AUTOMOTIVE ELECTRONICS TECHNOLOGY EXPO / EV JAPAN. Details of last fair is including the concurrent events.