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|
| | Duration | : |
17th Jan. 2007 ~ 19th Jan. 2007 | | Open To | : |
Trade Visitors |
| Venue | : |
Tokyo Big Sight, Tokyo, Japan |
| Exhibits | : |
Assembly Equipment, Packaging Materials / Components, Inspection Equipment / Testers / Measurement, Analysis / Simulation Software for IC Packaging, Various Packages. |
| Organiser | : |
|
| Industry Segment | : |
| • | Machinery, Industrial Technology / Electric & Electronics (Products, Machinery)
| | | • | Machinery, Industrial Technology / Testing, Measuring & Analyzing, Precision Mechanics | |
|
| Periodical | : |
Annual | | Description | : |
IC packaging outsourcing, assembly equipment, packaging, materials, components, inspectors, testers, measuring products, packaging equipment, and other IC related packaging technology. |
| Previous Year (2006) Information |
| Visitros |
: |
46542 |
Exhibitors |
: |
850 |
| Total Area |
: |
- |
Audited By |
: |
- |
| |
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