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| Duration | : |
20th Jan. 2010 ~ 22nd Jan. 2010 |
| Open To | : |
Trade Visitors and Public |
| Venue | : |
Tokyo Big Sight, Tokyo, Japan |
| Exhibits | : |
Assembly Equipment, Packaging Materials / Components, Inspection Equipment / Testers / Measurement, Analysis / Simulation Software for IC Packaging, Various Packages. |
| Organiser | : |
| REED EXHIBITIONS JAPAN LTD. |
18F Shinjuku-Nomura Bldg.,1-26-2
Nishishinjuku,Shinjuku-ku |
| Tokyo- 163-0570 JAPAN | | Phone : 81-3-3349-8502 | | Fax : 81-3-3349-4900 | | Website : http://www.fcexpo.jp
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| Industry Segment | : |
| • | Machinery, Industrial Technology / Electric & Electronics (Products, Machinery) | | | • | Machinery, Industrial Technology / Testing, Measuring & Analyzing, Precision Mechanics | |
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| Periodical | : |
Annual |
| Description | : |
Concurrent shows : INTERNEPCON JAPAN / ELECTROTEST JAPAN / PRINTED WIRING BOARDS EXPO / INTERNATIONAL ELECTRONIC COMPONENTS TRADE SHOW / PHOTONICS JAPAN / MATERIAL JAPAN / INT'L AUTOMOTIVE ELECTRONICS TECHNOLOGY EXPO / EV JAPAN. Details of last fair is including the concurrent events. |
| Previous Year (2009) Information |
| Visitros |
: |
60271 |
Exhibitors |
: |
1228 |
| Total Area |
: |
- |
Audited By |
: |
- |
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