Application Products with High-density/High-frequency electronics packaging technologies, High-density Substrates/Interporzers, IC Packages, Electronic Components, Embedded Packaging Board, System-in-a-Package, Display Device/Optical Device, Materials related to Electronics Packaging, Lead-free Solder, Polymer for High-frequency, Bonding/Mounting/Dispenser/Paste Printing Machines, Equipment for manufacturing, Environmental Consideration technologies, Recycle System, Electronics Packaging (Jisso) related Publication, Information, Services, etc.

Incorporationg with JPCA Show 2010 - International Electronic Circuits Exhibition. Details of previous show are total with concurrent shows.