Electronic components mounting machines and related equipment/systems, PCB assembly related equipment and systems, semiconductor mounting equipment and systems, inspection and testing equipment, electronic packaging design systems, electronic packaging devices, components and related materials, electronic manufacturing device packaging materials, electronic packaging joint systems, high frequency responding devices, components and materials, environment related equipment, components and materials, publications.

The creation of a venue featuring latest circuit mounting and processing technologies originating both in Japan and overseas, and to supply up-to-daste information regarding today's coustomers, andcreate new opportunities for business.