Industry's leading companies on System Integration in Micro Electronics - modern production, electronic systems, design & development, components, PCB, test systems, packaging & basis materials, machinery, apparatus, automobile engineering, information & communication technology, Advanced Packaging.

SMT/HYBRID/PACKAGING 2008 is an international exhibition and conference for System Integration in Micro Electronics. Traditionally the SMT/HYBRID/PACKAGING forms the ideal platform for the industry's leading companies. Among other things the show presents the latest trends and developments as well as up-to-date solutions. With foreign companies accounting for 33% of the exhibitors, the event offers not only a wide, but also an international spectrum. The highly qualified audience from over 50 countries rated the exhibition extremely positively. From design and development to PCB production, components, packaging and test systems - SMT/HYBRID/PACKAGING offers a comprehensive and compact presentation of products all under one roof!